• Epoxy Resin CAS 61788-97-4 Adhesive Agent, Thermoset Composites
  • Epoxy Resin CAS 61788-97-4 Adhesive Agent, Thermoset Composites
  • Epoxy Resin CAS 61788-97-4 Adhesive Agent, Thermoset Composites
  • Epoxy Resin CAS 61788-97-4 Adhesive Agent, Thermoset Composites
  • Epoxy Resin CAS 61788-97-4 Adhesive Agent, Thermoset Composites
  • Epoxy Resin CAS 61788-97-4 Adhesive Agent, Thermoset Composites

Epoxy Resin CAS 61788-97-4 Adhesive Agent, Thermoset Composites

CAS No.: 61788-97-4
Formula: (C11h12o3)N
EINECS: No
Bonding Function: High Temperature Resistant Adhesive
Morphology: Solid State and Liquid
Application: Automobile, Construction, Woodworking, Footwear & Leather, Fiber & Garment, Packing
Samples:
US$ 1/kg 1 kg(Min.Order)
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Customization:
Gold Member Since 2023

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Manufacturer/Factory, Group Corporation

Basic Info.

Model NO.
CT2124
Material
Epoxy
Classification
Thermosetting
Main Agent Composition
Thermosetting Resin
Characteristic
Waterproof
Promoter Composition
Tackifier
Composition
Inorganic Material
Color
Yellow
Density
1.2 g/cm3
Appearance
Yellow or Transparent Solid or Liquid
Applications
Preparation of Thermoset Composites or Adhesives
Mdl
Mfcd00084412
Transport Package
Bag, Drum
Specification
25KG 1000KG
Origin
China

Product Description

Epoxy Resin CAS 61788-97-4 Adhesive Agent, Thermoset Composites
In addition to poor adhesion to non-polar plastics such as polyolefins, epoxy resin also has good adhesion to various metal materials such as aluminum, iron, and copper; non-metallic materials such as glass, wood, concrete, etc.; and thermosetting plastics such as phenolics and amino acids. , unsaturated polyester, etc. all have excellent bonding properties, so they are called universal glue. Epoxy adhesives are an important variety of structural adhesives.

Epoxy resin's excellent physical, mechanical and electrical insulation properties, bonding properties with various materials, and flexibility in its use process are not available in other thermosetting plastics. Therefore, it can be made into coatings, composite materials, casting materials, adhesives, molding materials and injection molding materials, and is widely used in various fields of the national economy.
A, coating use
Epoxy resin accounts for a large proportion of applications in coatings, and it can be made into varieties with different characteristics and uses. Their common features:
1. Excellent chemical resistance, especially alkali resistance.
2. The paint film has strong adhesion, especially to metal.
3. Has good heat resistance and electrical insulation.
4. The paint film has good color retention.
However, bisphenol A-type epoxy resin coatings have poor weather resistance. The paint film is easily powdered and loses its luster and lacks fullness when outdoors. It is not suitable for outdoor coatings and highly decorative coatings. Therefore, epoxy resin coatings are mainly used as anti-corrosion paint, metal primer, and insulating paint, but coatings made of heterocyclic and alicyclic epoxy resins can be used outdoors.

B, adhesive use
In addition to poor adhesion to non-polar plastics such as polyolefins, epoxy resin also has good adhesion to various metal materials such as aluminum, iron, and copper; non-metallic materials such as glass, wood, concrete, etc.; and thermosetting plastics such as phenolics and amino acids. , unsaturated polyester, etc. all have excellent bonding properties, so they are called universal glue. Epoxy adhesives are an important variety of structural adhesives.

C, electronic appliances
Due to its many unique advantages such as high insulation performance, high structural strength and good sealing performance, epoxy resin has been widely used in the insulation and packaging of high and low voltage electrical appliances, motors and electronic components:
1. Casting of electrical appliances and motor insulation packages. Manufacturing of integral fully sealed insulating packages for high and low voltage electrical appliances such as electromagnets, contactor coils, transformers, dry-type transformers, etc. It has developed rapidly in the electrical appliance industry. From normal pressure pouring and vacuum pouring, it has developed to automatic pressure gel molding.
2. It is widely used for potting insulation of devices equipped with electronic components and circuits. It has become an indispensable and important insulating material in the electronics industry.
3. Electronic grade epoxy molding compound is used for plastic packaging of semiconductor components. Come develop extremely fast. Due to its superior performance, it has a tendency to replace traditional metal, ceramic and glass packaging.
4. Epoxy laminated plastics are widely used in the fields of electronics and electrical appliances. Among them, epoxy copper-clad laminate has developed particularly rapidly and has become one of the basic materials in the electronics industry.
In addition, epoxy insulating coatings, insulating adhesives and electrical adhesives are also widely used.
Epoxy Resin CAS 61788-97-4 Adhesive Agent, Thermoset CompositesEpoxy Resin CAS 61788-97-4 Adhesive Agent, Thermoset CompositesEpoxy Resin CAS 61788-97-4 Adhesive Agent, Thermoset CompositesEpoxy Resin CAS 61788-97-4 Adhesive Agent, Thermoset CompositesEpoxy Resin CAS 61788-97-4 Adhesive Agent, Thermoset Composites

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